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DCT OR DCU PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1A

1B

2C

GND

1C

2B

2A

4

3

2

1

5

6

7

8

GND

2C

1B

1A

2A

2B

1C

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74LVC2G66

DUAL BILATERAL ANALOG SWITCH

SCES325H – JULY 2001 – REVISED JULY 2005

•

Available in the Texas Instruments

NanoStar™ and NanoFree™ Packages

•

•

Inputs Accept Voltages to 5.5 V

•

•

High On-Off Output Voltage Ratio

•

High Degree of Linearity

•

High Speed, Typically 0.5 ns

•

Rail-to-Rail Input/Output

•

Low On-State Resistance, Typically

≈6 Ω

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

The SN74LVC2G66 can handle both analog and digital signals. The device permits signals with amplitudes of up

to 5.5 V (peak) to be transmitted in either direction.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the

associated switch section.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for

analog-to-digital and digital-to-analog conversion systems.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

SN74LVC2G66YEAR

0.17-mm Small Bump – YEA

NanoFree™ – WCSP (DSBGA)

SN74LVC2G66YZAR

0.17-mm Small Bump – YZA (Pb-free)

Reel of 3000

_ _ _C6_

NanoStar™ – WCSP (DSBGA)

SN74LVC2G66YEPR

0.23-mm Large Bump – YEP

–40°C to 85°C

NanoFree™ – WCSP (DSBGA)

SN74LVC2G66YZPR

0.23-mm Large Bump – YZP (Pb-free)

SSOP – DCT

Reel of 3000

SN74LVC2G66DCTR

C66_ _ _

Reel of 3000

SN74LVC2G66DCUR

VSSOP – DCU

C66_

Reel of 250

SN74LVC2G66DCUT

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2001–2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.