MRP

■Circuit Characteristics

Operating direction

Connecting terminal

Step angle

Clockwise

2

−1

Counterclockwise

2

−3

360

°Endless : 20±2 pulses

■Panel Cut-Out Dimensions

Panel thickness : 2 mm max.

Bracket mounting

Right angle

（Top View）

or

1. Soldering SpeciÄcations

⑴Manual Soldering

Device

： Soldering iron

270

℃, Max.; 3 seconds, Max.

⑵ Auto Soldering

Device: Jet wave type or dip type

260

±5℃; 5 seconds, Max.

・Pre-heating should be done at temperatures of 100℃ or

below and within 30 sec.

⑶When soldering two or more terminals to the common

land, use the solder resist to solder them independently.

3. Mounting of Switch

⑴ Do not apply a load exceeding 29.4 N・cm to the Äxing screws.

⑵Do not bend the terminals before mounting the switch on the PC board.

⑶After mounting the switch, do not place the device in such a way that the device weight

will be applied on the knob, etc. of the switch.

⑷Do not apply a load exceeding 16.7 N to the knob.

■Handling Precautions（MRP & DRS series）

2. Flux Cleaning

⑴ For the solvent, use the Åuorine-based or alcohol-based solvent.

Solvent: Fluorine or Alcohol type

⑵ Since the MRP Series products are not waterproof-

structured, if the PC board is to be cleaned, clean the

soldering surface of substrate with a brush so that the

switch is not exposed to the cleaning solution.