If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

LM146

LM346

Supply Voltage

Differential Input Voltage (Note 1)

CM Input Voltage (Note 1)

Power Dissipation (Note 2)

900 mW

500 mW

Output Short-Circuit Duration (Note 3)

Continuous

Continuous

Operating Temperature Range

−55˚C to +125˚C

0˚C to +70˚C

Maximum Junction Temperature

150˚C

100˚C

Storage Temperature Range

−65˚C to +150˚C

−65˚C to +150˚C

Lead Temperature (Soldering, 10 seconds)

260˚C

260˚C

Thermal Resistance (

θ

Cavity DIP (J)

Pd

900 mW

900 mW

θ

jA

100˚C/W

100˚C/W

Small Outline (M)

θ

jA

115˚C/W

Molded DIP (N)

Pd

500 mW

θ

jA

90˚C/W

Soldering Information

Dual-In-Line Package

Soldering (10 seconds)

+260˚C

+260˚C

Small Outline Package

Vapor Phase (60 seconds)

+215˚C

+215˚C

Infrared (15 seconds)

+220˚C

+220˚C

See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount de-

vices.

ESD rating is to be determined.

DC Electrical Characteristics

(V

Parameter

Conditions

LM146

LM346

Units

Min

Typ

Max

Min

Typ

Max

Input Offset Voltage

V

0.5

5

0.5

6

mV

Input Offset Current

V

2

20

2

100

nA

Input Bias Current

V

50

100

50

250

nA

Supply Current (4 Op Amps)

T

1.4

2.0

1.4

2.5

mA

Large Signal Voltage Gain

R

100

1000

50

1000

V/mV

T

Input CM Range

T

V

CM Rejection Ratio

R

80

100

70

100

dB

Power Supply Rejection Ratio

R

80

100

74

100

dB

V

Output Voltage Swing

R

V

Short-Circuit

T

5

20

35

5

20

35

mA

Gain Bandwidth Product

T

0.8

1.2

0.5

1.2

MHz

Phase Margin

T

60

60

Deg

Slew Rate

T

0.4

0.4

V/µs

Input Noise Voltage

f=1 kHz, T

28

28

Channel Separation

R

120

120

dB

Input Resistance

T

1.0

1.0

M

Ω

Input Capacitance

T

2.0

2.0

pF

Input Offset Voltage

V

0.5

6

0.5

7.5

mV

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