If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Positive Supply Voltage

+8V

Negative Supply Voltage

−8V

Peak Output Current

20 mA

Differential Input Voltage

Input Voltage

V

+

≥ V

−

ESD Tolerance (Note 9)

1600V

Operating Temperature Range

LM160

−55˚C to +125˚C

LM360

0˚C to +70˚C

Storage Temperature Range

−65˚C to +150˚C

Lead Temperature

(Soldering, 10 sec.)

260˚C

Soldering Information

Dual-In-Line Package

Soldering (10 seconds)

260˚C

Small Outline Package

Vapor Phase (60 seconds)

215˚C

Infrared (15 seconds)

220˚C

See AN-450 “Surface Mounting Methods and Their Effect

on Product Reliability” for other methods of soldering

surface mount devices.

Electrical Characteristics

(T

Parameter

Conditions

Min

Typ

Max

Units

Operating Conditions

Supply Voltage V

CC

+

4.5

5

6.5

V

Supply Voltage V

CC

−

−4.5

−5

−6.5

V

Input Offset Voltage

R

25

mV

Input Offset Current

0.5

3

µA

Input Bias Current

520

µA

Output Resistance (Either Output)

V

100

Ω

Response Time

T

13

25

ns

T

12

20

ns

T

14

ns

Response Time Difference between Outputs

(t

2

ns

(t

2

ns

(t

2

ns

(t

2

ns

Input Resistance

f = 1 MHz

17

k

Ω

Input Capacitance

f = 1 MHz

3

pF

Average Temperature Coefficient of

R

8

µV/˚C

Input Offset Voltage

Average Temperature Coefficient of

7

nA/˚C

Input Offset Current

Common Mode Input Voltage Range

V

V

Differential Input Voltage Range

Output High Voltage (Either Output)

I

2.4

3

V

Output Low Voltage (Either Output)

I

0.25

0.4

V

Positive Supply Current

V

18

32

mA

Negative Supply Current

V

−9

−16

mA

Note 2: Response time measured from the 50% point of a 30 mVp-p 10 MHz sinusoidal input to the 50% point of the output.

Note 3: Response time measured from the 50% point of a 2 Vp-p 10 MHz sinusoidal input to the 50% point of the output.

Note 4: Response time measured from the start of a 100 mV input step with 5 mV overdrive to the time when the output crosses the logic threshold.

Note 5: Typical thermal impedances are as follows:

Cavity DIP (J):

135˚C/W

Header (H)

165˚C/W

(Still Air)

Molded DIP (N):

130˚C/W

67˚C/W

(400 LF/min Air Flow)

25˚C/W

Note 6: The device may be damaged if used beyond the maximum ratings.

Note 7: Measurements are made in AC Test Circuit, Fanout = 1

Note 8: Refer to RETS 160X for LM160H, LM160J-14 and LM160J military specifications.

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