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Reference for Manual Soldering

Example of Reflow Soldering Condition

Reference for Dip Soldering

300

200

100

A

B

C

Time (s)

G max.

F max.

H max.

E max.

Room

temperature

Pre-heating

D

Series

Tip temperature

Duration of

Soldering time

No. of solders

RS□□1, RS□□H, RS08U,

RS□□K（Standard）,RS□□N,

RS□□N11S, RS6011□P,

RS□□N1□M,

RSA0K1□V（Motor terminal）

350℃ max.

3s max.

1 time

Series

Preheating

Dip soldering

Number of soldering

Soldering surface

temperature

Heating time

Soldering

temperature

Soldering time

RS□□1, RS□□H,

RS□□N, RS□□N11S,

RS6011□P, RS□□N1□M

100℃ max.

1 min. max.

260℃

5s max.

1 time

Series

A

B

C

D

E

F

G

H

No. of reflows

RS08U

250℃

200℃

150℃

150℃

2 min.

3s

40s

4 min.

1 time

1. When using an infrared reflow oven, solder may sometimes not be applied. Be sure to use a hot air reflow oven or a type that

uses infrared rays in combination with hot air.

2. The temperatures given above are the maximum temperatures at the terminals of the potentiometer when employing a hot air

reflow method. The temperature of the PC board and the surface temperature of the potentiometer may vary greatly depending

on the PC board material, its size and thickness. Ensure that the surface temperature of the potentiometer does not rise to

250°C or greater.

3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior to use.

Notes

Temperature profile

Slide Potentiometers / Soldering Conditions