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Input Voltage (Series Mode)

35V

Reverse Current (Shunt Mode)

50 mA

Power Dissipation (Note 7)

600 mW

Storage Temperature Range

b

Operating Temperature Range

LM169H LM169H883

b

LM369

Soldering Information

DIP (N) or Plastic (RC) Package 10 sec

a

260 C

H08 (H) Package 10 sec

a

300 C

SO (M) Package Vapor Phase (60 sec)

a

215 C

Infrared (15 sec)

a

220 C

See AN-450 ‘‘Surface Mounting Methods and Their Effect

on Product Reliability’’ (Appendix D) for other methods of

soldering surface mount devices

ESD Tolerance

800V

Tested

Design

Units

Parameter

Conditions

Typical

Limits

Limit

(Max

(Notes 2 13)

(Note 3)

Unless

Noted)

a

10000

V

(Note 11)

50

g

500

ppm

050

g

5mV

LM169B LM369B

10

30

ppm C

LM169 LM369

27

50

ppm C

LM369C

6

10

ppm C

(Note 6) (Note 11)

Line Regulation

20

40

80

ppmV

Load Regulation

Sourcing

0 to 10 mA

a

3

g

80

200

ppmmA

Sinking (Note 12)

a

80

a

150

ppmmA

(Note 4 Note 9)

Thermal Regulation

Sourcing

After Load

30

g

20

ppm100 mW

Sinking (Note 12)

is Applied)

30

ppm100 mW

(Note 5)

Supply Current

14

18

20

mA

D

Supply Current

006

012

02

mA

Short Circuit

27

15

11

mA min

Current

50

65

mA max

Noise Voltage

10 Hz to 1 kHz

10

30

m

V rms

01 Hz to 10 Hz

4

m

V p-p

(10 Hz to 10 kHz

4

m

V rms

Long-term

1000 hours

6

ppm

Stability

(Non-Cumulative)

(Measured at

(Note 10)

a

25 C)

Temperature

D

3

ppm

Output Shift

1500

2600

ppm

per 1 mA at Pin 5

2