2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

V

-0.3V to 6.0V

Voltage on Logic Pins

-0.3V to V

0.3V, with 6.0V max

Voltage on LED Output Pins

-0.3V to V(FB) +

0.3V, with 6.0V max

Voltage on All Other Pins

-0.3V to V

0.3V, with 6.0V max

I (ROUT, GOUT, BOUT)

150 mA

I(V

Continuous Power Dissipation

(Note 3)

Internally Limited

Junction Temperature (T

125˚C

Storage Temperature Range

−65˚C to +150˚C

Maximum Lead Temperature

260˚C

(Reflow soldering, 3 times) (Note 4)

ESD Rating (Note 5)

Human Body Model:

2 kV

Machine Model:

200V

V

3.0V to 6.0V

V

DD_IO

1.8V – V

DD1,2

Recommended Load Current

0 mA to 250 mA

Junction Temperature (T

−40˚C to +125˚C

Ambient Temperature (T

(Note 6)

−40˚C to +85˚C

Thermal Properties

Junction-to-Ambient Thermal Resistance (

θ

SLD32A Package (Note 7)

72˚C/W

Limits in standard typeface are for T

(−40˚C

≤ T

A

≤ +85˚C). Unless otherwise noted, specifications apply to the Section Block Diagram with: V

= 3.6V, C

Symbol

Parameter

Condition

Min

Typ

Max

Units

V

DD1,2

Supply Voltage

3.0

3.6

6.0

V

I

DD

Standby Supply Current

(V

NSTBY = L (register)

CS, SCL, DI, NRST = H

V

1

7

µA

No-Load Supply Current

(V

NSTBY = H (reg.)

EN_BOOST = L (reg.)

SCL, CS, DI, NRST = H

170

300

µA

Full Load Supply Current

(V

NSTBY = H (register)

NRST, CS, SCL, DI = H

RGB_EN = L

WLED1…6=L

EN_AMBADC = L

1mA

I

DD_IO

V

NSTBY = L (register)

CS, SCL, DI, NRST = H

1µA

V

1 MHz Clock Frequency

C

20

µA

V

REF

Reference Voltage (Note 10)

I

REF

≤ 1 nA,

Test Purposes Only

1.205

−2

1.23

1.255

+2

V

%

V

DDA

LDO Output Voltage

IV

2.688

–4

2.8

2.912

+4

%V

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of

the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the

Electrical Characteristics tables.

Note 2: All voltages are with respect to the potential at the GND pins (GND1, GND2, GND_T, GND_BOOST, GND_WLED, GND_RGB).

140˚C (typ.).

Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1125: Laminate CSP/FBGA

Package (AN-1125).

Note 5: The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF capacitor discharged

directly into each pin. MIL-STD-883 3015.7

www.national.com

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