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OMAP3530ECBC 数据表(PDF) 260 Page - Texas Instruments |
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OMAP3530ECBC 数据表(HTML) 260 Page - Texas Instruments |
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260 / 265 page  PACKAGE OPTION ADDENDUM www.ti.com 30-Apr-2015 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples OMAP3530ECBB ACTIVE POP-FCBGA CBB 515 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 3530ECBB OMAP3530ECBB72 ACTIVE POP-FCBGA CBB 515 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 3530ECBB72 OMAP3530ECBBA ACTIVE POP-FCBGA CBB 515 168 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 105 3530ECBB A OMAP3530ECBBAR ACTIVE POP-FCBGA CBB 515 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 3530ECBB A OMAP3530ECBC ACTIVE POP-FCBGA CBC 515 119 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 3530ECBC OMAP3530ECBC72 ACTIVE POP-FCBGA CBC 515 119 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR 0 to 90 3530ECBC72 OMAP3530ECBCA ACTIVE POP-FCBGA CBC 515 119 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 105 3530ECBC A OMAP3530ECUS ACTIVE FCBGA CUS 423 90 Green (RoHS & no Sb/Br) SNAGCU Level-4-260C-72 HR 0 to 90 3530ECUS OMAP3530ECUS72 ACTIVE FCBGA CUS 423 90 Green (RoHS & no Sb/Br) SNAGCU Level-4-260C-72 HR 0 to 90 3530ECUS72 OMAP3530ECUSA ACTIVE FCBGA CUS 423 90 Green (RoHS & no Sb/Br) SNAGCU Level-4-260C-72 HR -40 to 105 3530ECUS A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) |
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