0.10

1.00

10.00

100.00

1000.00

10000.00

80

90

100

110

120

130

140

150

160

Wirebond Voiding

Fail Mode

Electromigration

Fail Mode

REF3212-EP, REF3220-EP, REF3225-EP

REF3230-EP, REF3233-EP, REF3240-EP

www.ti.com

SBVS078B

– OCTOBER 2006 – REVISED AUGUST 2011

Electrical Characteristics (continued)

Boldface limits apply over the listed temperature range.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Output current

(1)

–10

10

mA

Sourcing

50

Short-circuit

mA

current

Sinking

40

Turn-on settling time

60

μs

Reference in shutdown mode

0

0.7

V

Reference is active

1.5

Power supply Voltage

5.5

V

Power supply Current

100

120

μA

115

135

μA

Overtemperature shutdown

ENABLE

< 0.7 V

0.1

1

μA

Specified

–55

125

°C

Temperature

Operating

–55

125

range

Storage

–65

150

Thermal resistance, SOT23-6

200

°C/W

(4)

If the rise time of the input voltage is less than or equal to 2ms, the ENABLE and IN pins can be tied together. For rise times greater

than 2ms, see the Supply Voltage section.

Figure 2. Operating Life Derating Chart

A.

See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.

B.

Silicon Operating Life Design Goal is 10 years at 105

°C Junction Temperature (does not include package

interconnect life).

C.

Enhanced Plastic Product Disclaimer Applies.

Copyright

© 2006–2011, Texas Instruments Incorporated

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Product Folder Link(s): REF3212-EP, REF3220-EP, REF3225-EP REF3230-EP, REF3233-EP, REF3240-EP

Not Recommended For

New Designs