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MIC28512 数据表(PDF) 17 Page - Microchip Technology |
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MIC28512 数据表(HTML) 17 Page - Microchip Technology |
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17 / 34 page ![]() 2016 Microchip Technology Inc. DS20005524A-page 17 MIC28512 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Symbol Description 1 DL Low-Side Gate Drive. Internal low-side power MOSFET gate connection. This pin must be left unconnected or floating. 2 PGND PGND is the return path for the low-side driver circuit. Connect to the source of low-side MOSFET’s (PGND, pins 10, 11 22, 23, and 26) through a low-impedance path. 3 DH High-Side Gate Drive. Internal high-side power MOSFET gate connection. This pin must be left unconnected or floating. 4, 7, 8, 9, 25 (25 is ePad) PVIN Power Input Voltage. The PVIN pins supply power to the internal power switch. Connect all PVIN pins together and bypass locally with ceramic capacitors. The positive terminal of the input capacitor should be placed as close as possible to the PVIN pins, the negative terminal of the input capacitor should be placed as close as possible to the PGND pins 10,11, 22, 23, and 26. 5 LX The LX pin is the return path for the high-side driver circuit. Connect the negative terminal of the bootstrap capacitor directly to this pin. Also connect this pin to the SW pins 12, 21, and 27, with a low-impedance path. The controller monitors voltages on this and PGND for zero current detection. 6 BST Bootstrap Pin. This pin provides bootstrap supply for the high-side gate driver circuit. Connect a 0.1 µF capacitor and an optional resistor in series from the LX (pin 5) to the BST. 10, 11, 22, 23, 26 (26 is ePad) PGND Power Ground. These pins are connected to the source of the low-side MOSFET. They are the return path for the step-down regulator power stage and should be tied together. The negative terminal of the input decoupling capacitor should be placed as close as possible to these pins. 12, 21, 27 (27 is ePad) SW Switch Node. The SW pins are the internal power switch outputs. These pins should be tied together and connected to the output inductor. 13 AGND Analog Ground. The analog ground for VDD and the control circuitry. The analog ground return path should be separate from the power ground (PGND) return path. 14 FB Feedback Input. The FB pin sets the regulated output voltage relative to the internal reference. This pin is connected to a resistor divider from the regulated output such that the FB pin is at 0.8V when the output is at the desired voltage. 15 PGOOD The power good output is an open drain output requiring an external pull-up resistor to external bias. This pin is a high impedance open circuit when the voltage at FB pin is higher than 90% of the feedback reference voltage (typically 0.8V). 16 EN Enable Input. The EN pin enables the regulator. When the pin is pulled below the threshold, the regulator will shut down to an ultra-low current state. A precise threshold voltage allows the pin to operate as an accurate UVLO. Do not tie EN to VDD 17 VIN Supply voltage for the internal LDO. The VIN operating voltage range is from 4.6V to 70V. A ceramic capacitor from VIN to AGND is required for decoupling. The decoupling capacitor should be placed as close as possible to the supply pin. 18 ILIM Current Limit Setting. Connect a resistor from this pin to the SW pin node to allow for accurate current limit sensing programming of the internal low-side power MOSFET. 19 VDD Internal +5V Linear Regulator: VDD is the internal supply bus for the IC. Connect to an external 1 µF bypass capacitor. When VIN is <5.5V, this regulator operates in drop-out mode. Connect VDD to VIN. 20 PVDD A 5V supply input for the low-side N-channel MOSFET driver circuit, which can be tied to VDD externally. A 1 μF ceramic capacitor from PVDD to PGND is recommended for decoupling. 24 FREQ Switching Frequency Adjust pin. Connect this pin to VIN to operate at 680 kHz. Place a resistor divider network from VIN to the FREQ pin to program the switching frequency. |
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