April 2003

21

MIC2582/MIC2583

MIC2582/MIC2583

Micrel

MOSFET Vendors

Key MOSFET Type(s)

Applications*

Contact Information

Vishay (Siliconix)

Si4420DY (SO-8 package)

www.siliconix.com

Si4442DY (SO-8 package)

(203) 452-5664

Si4876DY (SO-8 package)

Si7892DP (PowerPAK™ SO-8)

International Rectifier

IRF7413 (SO-8 package)

www.irf.com

IRF7457 (SO-8 package)

(310) 322-3331

IRF7601 (SO-8 package)

Fairchild Semiconductor

FDS6680A (SO-8 package)

www.fairchildsemi.com

(207) 775-8100

Philips

PH3230 (SOT669-LFPAK)

www.philips.com

Hitachi

HAT2099H (LFPAK)

www.halsp.hitachi.com

(408) 433-1990

* These devices are not limited to these conditions in many cases, but these conditions are provided as a helpful reference for customer applications.

Resistor Vendors

Sense Resistors

Contact Information

Vishay (Dale)

“WSL” Series

www.vishay.com/docswsl_30100.pdf

(203) 452-5664

IRC

“OARS” Series

www.irctt.com/pdf_files/OARS.pdf

“LR” Series

www.irctt.com/pdf_files/LRC.pdf

(second source to “WSL”)

(828) 264-8861

Table 4. MOSFET and Sense Resistor Vendors

Power MOSFET, timer(s), and feedback network connec-

tions. The feedback network resistor values are selected for

a 12V application. Many hot swap applications will require

load currents of several amperes. Therefore, the power (V

CC

and Return) trace widths (W) need to be wide enough to allow

the current to flow while the rise in temperature for a given

copper plate (e.g., 1oz. or 2oz.) is kept to a maximum of

10

°C~25°C. Also, these traces should be as short as possible

in order to minimize the IR drops between the input and the

load. For a starting point, there are many trace width calcu-

lation tools available on the web such as the following link:

http://www.aracnet.com/cgi-usr/gpatrick/trace.pl

Finally, the use of plated-through vias will be needed to make

circuit connections to power and ground planes when utilizing

multi-layer PC boards.

MOSFET and Sense Resistor Vendors

Device types and manufacturer contact information for power

MOSFETs and sense resistors is provided in Table 4. Some

of the recommended MOSFETs include a metal heat sink on

the bottom side of the package. The recommended trace for

the MOSFET Gate of Figure 11 must be redirected when

using MOSFETs packaged in this style. Contact the device

manufacturer for package information.