PL500-17

Low Phase Noise VCXO (17MHz to 36MHz)

DIE PAD LAYOUT

DIE SPECIFICATIONS

Name

Value

Size

39 x 32 mil

Reverse side

GND

Pad dimensions

80 micron x 80 micron

Thickness

8 mil

PACKAGE PIN AND DIE PAD ASSIGNMENT

Name

Pin#

Die Pad Position

Type

Description

SOP-8

SOT23-6

X (

m)

Y (

m)

XIN

1

6

94.183

768.599

I

Crystal input pin.

VDD

2

5

94.157

605.029

P

VDD power supply pin. Only one VDD pin is

necessary.

VCON

3

4

94.183

331.756

I

Frequency control voltage input pin.

GND

4

2

94.193

140.379

P

Ground pin.

CLK

5

3

715.472

203.866

O

Output clock pin.

VDD

6

-

715.307

455.726

P

VDD power supply pin. Only one VDD pin is

necessary.

OE*

7

-

715.472

626.716

I

Output Enable input pin. Disables the output

when low. Internal pull-up enables output by

default if pin is not connected to low.

XOUT

8

1

476.906

888.881

I

Crystal output pin. Ref Clock input.

* OE (Output Enable) pin is not available in SOT23-6L package, the output will always be enabled by the build in pull-up resister.

5

Y

X

(0,0)

(812,986)

32 mil

8

6

2

3

4

7

1

XIN

VDD

CLK

GND

VCON

XOUT

OE^

VDD

Note: ^ denotes internal pull up