Data Sheet

ADP1761

Rev. 0 | Page 17 of 18

PCB LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP1761.

However, as shown in Table 8, a point of diminishing returns is

eventually reached, beyond which an increase in the copper size

does not yield significant heat dissipation benefits.

Use the following recommendations when designing PCBs:



Place the input capacitor as close as possible to the VIN

and GND pins.



Place the output capacitor as close as possible to the VOUT

and GND pins.



SS pin.



VREG pin, respectively.



Connect the load as close as possible to the VOUT and

SENSE pins.

Use of 0603 or 0805 size capacitors and resistors achieves the

smallest possible footprint solution on boards where area is

limited.

Figure 44. Evaluation Board

Figure 45. Typical Board Layout, Top Side

Figure 46. Typical Board Layout, Bottom Side