ADP7158

Data Sheet

Rev. A | Page 20 of 22

PRINTED CIRCUIT BOARD (PCB) LAYOUT CONSIDERATIONS

Place the input capacitor as close as possible between the

VIN pin and ground. Place the output capacitor as close as possible

between the VOUT pin and ground. Place the bypass capacitors

tive pins (VREG, REF, and BYP) and ground. The use of a 0805,

0603, or 0402 size capacitor achieves the smallest possible

footprint solution on boards where area is limited. Maximize

the amount of ground metal for the exposed pad, and use as

many vias as possible on the component side to improve thermal

dissipation.

Figure 62. Sample 10-Lead LFCSP PCB Layout

Figure 63. Sample 8-Lead SOIC PCB Layout