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CLC2000 数据表(PDF) 13 Page - Exar Corporation |
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CLC2000 数据表(HTML) 13 Page - Exar Corporation |
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13 / 18 page ![]() Data Sheet ©2007-2013 Exar Corporation 13/18 Rev 1D Application Information Basic Operation Figures 1 and 2 illustrate typical circuit configurations for non-inverting, inverting, and unity gain topologies for dual supply applications. They show the recommended bypass capacitor values and overall closed loop gain equations. + - Rf 0.1μF 6.8μF Output G = 1 + (Rf/Rg) Input +Vs -Vs Rg 0.1μF 6.8μF RL Figure 1. Typical Non-Inverting Gain Circuit Figure 2. Typical Inverting Gain Circuit Power Supply and Decoupling The CLC2000 and CLC4000 can be powered with a low noise supply anywhere in the range from +5V to +13V. Ensure adequate metal connections to power pins in the PC board layout with careful attention paid to decoupling the power supply. High quality capacitors with low equivalent series resis- tance (ESR) such as multilayer ceramic capacitors (MLCC) should be used to minimize supply voltage ripple and power dissipation. Two decoupling capacitors should be placed on each pow- er pin with connection to a local PC board ground plane. A large, usually tantalum, 10μF to 47μF capacitor is required to provide good decoupling for lower frequency signals and to provide current for fast, large signal changes at the CLC2000/CLC4000 outputs. It should be within 0.25” of the pin. A secondary smaller 0.1μF MLCC capacitor should located within 0.125” to reject higher frequency noise on the power line. Power Dissipation Power dissipation is an important consideration in applica- tions with low impedance DC, coupled loads. Guidelines listed below can be used to verify that the particular ap- plication will not cause the device to operate beyond its intended operating range. Calculations below relate to a single amplifier. For the CLC2000/CLC4000, all amplifiers power contribution needs to be added for the total power dissipation. Maximum power levels are set by the absolute maximum junction rating of 150°C. To calculate the junction tem- perature, the package thermal resistance value ThetaJA (ӨJA) is used along with the total die power dissipation. TJunction = TAmbient + (ӨJA × PD) Where TAmbient is the temperature of the working environ- ment. In order to determine PD, the power dissipated in the load needs to be subtracted from the total power delivered by the supplies. PD = Psupply - Pload Supply power is calculated by the standard power equa- tion. Psupply = Vsupply × I(RMS supply) Vsupply = V(S+) - V(S-) Power delivered to a purely resistive load is: Pload = ((VLOAD)RMS2) / Rloadeff The effective load resistor will need to include the effect of the feedback network. For instance, Rloadeff in figure 1 would be calculated as: RL || (Rf + Rg) + - Rf 0.1μF 6.8μF Output G = - (Rf/Rg) For optimum input offset voltage set R1 = Rf || Rg Input +Vs -Vs 0.1μF 6.8μF RL Rg R1 |
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