A

B

C

Top and Bottom View

Side View

D

Top View

Style 2

Style 1

Bottom View

Side View

Recommended Pad Layout

A

B

D

C

2.95 ± 0.10

(.114 ± .004)

3.1 ± 0.10

(.122 ± .004)

1.68 ± 0.05

(.066 ± .002)

Recommended Pad Layout

3.2 ± 0.1

(0.126 ± .004)

2.7 ± 0.1

(.106 ± .004)

1.5 ± 0.05

(.059 ± .002)

1.5 ± 0.05

(.059 ± .002)

Terminal material:

Electroless Ni under immersion Au

Termination pad solderability:

Standard Au finish:

Meets ANSI/J-STD-002 Category 2.

Recommended Storage:

40 °C max./70 % RH max.

Product Dimensions (see previous page for dimensions)

Typical Time to Trip at 23 ˚C

C

A

The Time to Trip curves represent typical

performance of a device in a simulated

application environment.Actual performance

in specific customer applications may differ

from these values due to the influence of

other variables.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

Specifications are subject to change without notice.

0.001

0.01

0.1

1

10

100

0

0

1

0

1

1

1

.

0

PRCP-MSMF020

PRCP-MSMF030

PRCP-MSMF200

PRCP-MSMF014

PRCP-MSMF010

PRCP-MSMF050

PRCP-MSMF075

PRCP-MSMF075/24

PRCP-MSMF110

PRCP-MSMF110/16

PRCP-MSMF125

PRCP-MSMF150

PRCP-MSMF160

PRCP-MSMF260

Fault Current (Amps)