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MIC2102 数据表(PDF) 3 Page - Micrel Semiconductor |
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MIC2102 数据表(HTML) 3 Page - Micrel Semiconductor |
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3 / 36 page ![]() Micrel, Inc. MIC2101/02 November 13, 2013 3 Revision 2.0 Pin Configuration (Continued) Pin Number Pin Name Pin Function 7DH High-Side Drive Output. High-current driver output for external high-side MOSFET of a buck converter. The DH driving voltage is floating on the switch node voltage (VSW). Adding a small resistor between DH pin and the gate of the high-side N-channel MOSFET can slow down the turn-on and turn-off speed of the MOSFET. 8SW Switch Node and Current-Sense input. High current output driver return. The SW pin connects directly to the switch node. Due to the high-speed switching on this pin, the SW pin should be routed away from sensitive nodes. The SW pin also senses the current by monitoring the voltage across the low-side MOSFET during OFF time. In order to sense the current accurately, connect the low-side MOSFET drain to the SW pin using a Kelvin connection. 9, 11 NC No Connection. 10 BST Voltage supply input for the high-side N-channel MOSFET driver, which can be powered by a ceramic capacitor. Adding a small resistor at BST pin can slow down the turn-on speed of the high-side MOSFET. 12 AGND Signal ground for VDD and the control circuitry, which is connected to thermal pad electronically. The signal ground return path should be separate from the power ground (PGND) return path. 13 FB Feedback Input. Input to the transconductance amplifier of the control loop. The FB pin is regulated to 0.8V. A resistor divider connecting the feedback to the output is used to set the desired output voltage. 14 PG Power Good Output. Open drain output, an external pull-up resistor to VDD or external power rails is required. 15 EN Enable Input. A logic signal to enable or disable the buck converter operation. The EN pin is CMOS compatible. Logic high enables the device, logic low shutdowns the regulator. In the disable mode, the VDD supply current for the device is minimized to 0.7mA typically. Don not pull EN pin to VDD/PVDD. 16 VIN from VIN to AGND is required for decoupling. EP ePad Exposed Pad. Connect the EPAD to PGND plain on the PCB to improve the thermal performance. |
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