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TDA7463AD 数据表(PDF) 9 Page - STMicroelectronics |
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TDA7463AD 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 11 page ![]() 9/11 TDA7463AD Figure 14. SSOP20 Mechanical Data & Package Dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 2.000 0.079 A1 0.050 0.002 A2 1.650 1.750 1.850 0.065 0.069 0.073 b 0.220 0.380 0.009 0.015 c 0.090 0.250 0.005 0.010 D (1) 6.900 7.200 7.500 0.272 0.283 0.295 E 7.400 7.800 8.200 0.291 0.307 0.323 E1 (1) 5.000 5.300 5.600 0.197 0.209 0.220 e (2) 0.650 0.026 L 0.550 0.750 0.950 0.022 0.029 0.037 L1 1.250 0.049 k 0˚ (min.), 4˚ (typ.), 8˚ (max.) ddd 0.100 0.004 Notes: 1. D and E1 does not include mold flash or protrusions, but do include mold mismatch and are measured at datum plane “H”. Mold flash or potrusions shall not ex- ceed 0.20mm (.008inch) both side. 2. “b” dimensions does not include dambar protusion/in- trusion. SSOP20 0061436 C (Jedec MO-150-AE) |
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