SAW FILTER

HDF415C

S3

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Page 4 of 7

3.TEST CIRCUIT

4. DIMENSION

5. ENVIRONMENTAL CHARACTERISTICS

5-1 Temperature cycling

Subject the device to a low temperature of -40℃ for 30 minutes. Following by a

high temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30

Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the

measurement. It shall meet the specifications in table 1.

5-2 Resistance to solder heat

Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec.

Then release the device into the room conditions for 4 hours. It shall meet the specifications

in table 1.

5-3 Solderability

Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than

95% area of the soldering pad must be covered with new solder. It shall meet the

specifications in table 1.

2.INPUT

6. OUTPUT

1.3.5.7:GROUND

4.8 GROUND