µPC358

9

RECOMMENDED SOLDERING CONDITIONS

When soldering these products, it is highly recommended to observe the conditions as shown below. If other

soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult

with our sales offices.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Type of Surface Mount Device

µPC358G2: 8-pin plastic SOP (225 mil)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 230

°C or below (Package surface temperature),

IR30-00-1

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 1 time.

Vapor phase soldering

Peak temperature: 215

°C or below (Package surface temperature),

VP15-00-1

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 1 time.

Wave soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

WS60-00-1

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120

°C or below (Package surface temperature).

Partial heating method

Pin temperature: 300

°C or below,

–

Heat time: 3 seconds or less (Per each side of the device).

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the

device will be damaged by heat stress.

Types of Through-hole Device

µPC358C: 8-pin plastic DIP (300 mil)

µPC358HA: 9-pin slim SIP

Process

Conditions

Wave soldering

Solder temperature: 260

°C or below,

(only to leads)

Flow time: 10 seconds or less.

Partial heating method

Pin temperature: 300

°C or below,

Heat time: 3 seconds or less (per each lead).

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.