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BSC019N04LS 数据表(PDF) 3 Page - Infineon Technologies AG |
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BSC019N04LS 数据表(HTML) 3 Page - Infineon Technologies AG |
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3 / 13 page ![]() 3 OptiMOSTMPower-MOSFET,40V BSC019N04LS Rev.2.1,2016-05-24 Final Data Sheet 1Maximumratings atTA=25°C,unlessotherwisespecified Table2Maximumratings Values Min. Typ. Max. Parameter Symbol Unit Note/TestCondition Continuous drain current ID - - - - - - - - - - 100 98 100 82 27 A VGS=10V,TC=25°C VGS=10V,TC=100°C VGS=4.5V,TC=25°C VGS=4.5V,TC=100°C VGS=10V,TA=25°C,RthJA=50K/W1) Pulsed drain current 2) ID,pulse - - 400 A TC=25°C Avalanche energy, single pulse 3) EAS - - 90 mJ ID=50A,RGS=25 Ω Gate source voltage VGS -20 - 20 V - Power dissipation Ptot - - - - 78 2.5 W TC=25°C TA=25°C,RthJA=50K/W1) Operating and storage temperature Tj,Tstg -55 - 150 °C IEC climatic category; DIN IEC 68-1: 55/150/56 2Thermalcharacteristics Table3Thermalcharacteristics Values Min. Typ. Max. Parameter Symbol Unit Note/TestCondition Thermal resistance, junction - case, bottom RthJC - 1.0 1.6 K/W - Thermal resistance, junction - case, top RthJC - - 20 K/W - Device on PCB, 6 cm 2 cooling area1) RthJA - - 50 K/W - 1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 2) See Diagram 3 for more detailed information 3) See Diagram 13 for more detailed information |
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