NLAS1053

www.onsemi.com

2

MAXIMUM RATINGS

Parameter

Symbol

Value

Unit

Positive DC Supply Voltage

−0.5 to +7.0

V

Digital Input Voltage (Select and Inhibit)

−0.5 ≤ V is ≤ +7.0

V

V

DC Current, Into or Out of Any Pin

50

mA

Storage Temperature Range

−65 to +150

_C

Lead Temperature, 1 mm from Case for 10 Seconds

260

_C

Junction Temperature under Bias

+150

_C

Thermal Resistance

250

_C/W

Power Dissipation in Still Air at 85

_C

250

mW

Moisture Sensitivity

MSL

Level 1

Flammability Rating

Oxygen Index: 30% − 35%

UL 94 V−0 @ 0.125 in

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

> 2000

200

N/A

V

Latchup Performance

±300

mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

5. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Characteristics

Symbol

Min

Max

Unit

Positive DC Supply Voltage

2.0

5.5

V

Digital Input Voltage (Select and Inhibit)

GND

5.5

V

Static or Dynamic Voltage Across an Off Switch

GND

V

Analog Input Voltage (CH, COM)

GND

V

Operating Temperature Range, All Package Types

−55

+125

°C

Input Rise or Fall Time

(Enable Input)

0

0

100

20

ns/V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

DEVICE JUNCTION TEMPERATURE VERSUS TIME

TO 0.1% BOND FAILURES

Junction

Temperature

5C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

TIME, YEARS

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 2. Failure Rate versus

Time Junction Temperature