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LM26 数据表(PDF) 2 Page - National Semiconductor (TI) |
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LM26 数据表(HTML) 2 Page - National Semiconductor (TI) |
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2 / 15 page ![]() Connection Diagrams micro SMD package 20036404 TOP VIEW 20036405 BOTTOM VIEW Ordering Information Order Number Package Type NSC Package Marking(*) Supplied As 10-Pin micro SMD LM2618ATL 10-bump Wafer Level Chip Scale (micro SMD) XYTT IS55A 250 Units, Tape and Reel LM2618BTL XYTT IS55B 250 Units, Tape and Reel LM2618ATLX XYTT IS55A 3000 Units, Tape and Reel LM2618BTLX XYTT IS55B 3000 Units, Tape and Reel (*) XY - denotes the date code marking (2 digit) in production (*) TT - refers to die run/lot traceability for production (*) I - pin one indication (*) S - Product line designator Note that Package Marking may change over the course of production www.national.com 2 |
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