DATA SHEET

DESCRIPTION

The EB2 series is a version of the EA2 series, suitable for surface mounting with infrared soldering (lRS) and

vapor phase soldering (VPS). This series has three variations of high solder joint reliability type, and low profile

type.

FEATURES

™ Compact and lightweight : 7.5 mm

× 14.3 mm × 9.3 mm, 1.5 g

™ 2 form c contact arrangement

™ Low power consumption

™ Low magnetic interference

™ Breakdown voltage: 1 000 VAC (surge voltage 1 500 V), FCC Part 68 conformable

™ UL recognized (E73266), CSA certified (LR 46266)

™ Lineup in non-latch, single-coil latch and double-coil latch types

™ Lineup in minimum footprint (9.3

× 14.3), and high solder joint reliability (20 years) types

™ Lineup in low profile type (hight : 6.5 mm), and Ultra-low profile (hight : 5.6 mm)

APPLICATIONS

Electronic switching systems, PBX, key telephone systems, automatic test equipment and other electronic equipment.

ATTENTION

DO NOT EXCEED MAXIMUM RATINGS.

Do not use relays under exceeding conditions such as over ambient temperature, over voltage and over

current. Incorrect use could result in abnormal heating, damage to related parts or cause burning.

READ CAUTIONS IN THE SELECTION GUIDE.

Read the cautions described in NEC's "Miniature Relays" (ER0046EJ

∗) when you choose relays for

your application.

EB2 SERIES

MINIATURE SIGNAL RELAY

COMPACT AND LIGHT WEIGHT

SURFACE MOUNTING TYPE

Document No. ER0016EJ5V0DS00 (5th edition)

Date Published February 1999 M

Printed in Japan

The information in this document is subject to change without notice.

©

1994