CS5301 datasheet(2/20 Pages) ONSEMI

2 / 20 page

CS5301

http://onsemi.com

R12

20 K

COMP

VFB

VDRP

CS1

CS2

CS3

CSREF

PWRGD

VID0

VID1

VID2

VID3

VID4

PWRGDS

ROSC

VCCL

VCCL1

Gate(L)1

GND1

Gate(H)1

VCCH12

Gate(H)2

GND2

Gate(L)2

VCCL23

Gate(L)3

GND3

Gate(H)3

ILIM

REF

VCCH3

LGND

3.09 k

1.40 k

0.1

µF

30 k

CS2

.01

µF

.01

µF

CS3

30 k

CS1

.01

µF

30 k

.01

µF

VID0

VID1

VID2

VID3

VID4

PWRGD

10 k

19.1 k

80.6 k

CS2

1.0

µF

CS3

1.0

µF

CS1

1.0

µF

C25–32

× 10 µF

C17–24

× 4SP560M

VCORE

C14

1.0

µF

+5.0 V

× 16SP180M

C15,16

300 nH

+12 V

1.0

µF

1.0

µF

1.0

µF

+5.0 V

BAT54S

56.2 K

0.1

µF

R10

10 K

C12

1.0 nF

C11

1.0 nF

+12 V

BAS16LT1

Figure 1. Application Diagram for Intel Pentium

® 4 Processor

12 V to 1.7 V, 42 A

C10

470 pF

+5.0 V

R11

1.0

Ω

BAT54S

Q1–Q6, NTB85N03 or NTB85N03T4 by ON Semiconducto

MAXIMUM RATINGS*

Rating

Value

Unit

Operating Junction Temperature

150

°C

Storage Temperature Range

–65 to +150

°C

ESD Susceptibility (Human Body Model)

2.0

Thermal Resistance, Junction–to–Case, RΘJC

°C/W

Thermal Resistance, Junction–to–Ambient, RΘJA

°C/W

Lead Temperature Soldering:

Reflow: (SMD styles only) (Note 1)

230 peak

°C

1. 60 second maximum above 183

°C.

*The maximum package power dissipation must be observed.

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