www.ixysic.com

4

R02

PLB171

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest

version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We

test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our

devices when handled according to the limitations and information in that standard as well as to any limitations set

forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled

according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device

Moisture Sensitivity Level (MSL) Classification

PLB171P

MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

Provided in the table below is the Classification Temperature (T

body temperature of this device may be above (T

Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other

processes, the guidelines of J-STD-020 must be observed.

Device

Classification Temperature (T

Dwell Time (t

Max Reflow Cycles

PLB171P

260ºC

30 seconds

3

Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce

or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken

to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash

and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the

washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake

temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the

user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not

be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.