Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/elx

© 2015 Eaton

All Rights Reserved

Printed in USA

Publication No. 4326 BU-SB15120

December 2015

Eaton is a registered trademark.

All other trademarks are property

of their respective owners.

6125FF

Fast-acting subminiature fuses

Technical Data

4326

Effective December 2015

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Wave solder profile

Reference EN 61760-1:2006

Profile feature

Standard SnPb solder

Lead (Pb) free solder

Preheat and soak • Temperature min. (Tsmin)

100°C

100°C

• Temperature typ. (Tstyp)

120°C

120°C

• Temperature max. (Tsmax)

130°C

130°C

• Time max. (Tsmin to Tsmax) (ts)

70 Seconds

70 Seconds

∆ preheat to max Temeperature

150°C max.

150°C max.

Peak temperature (Tp)

235°C - 260°C

250°C - 260°C

Peak package body temperature (TP)*

Table 1

Table 2

Time at peak temperature (tp)

10 seconds max

5 seconds max each wave

10 seconds max

5 seconds max each

Ramp-down rate

~ 2 K/s min

~3.5 K/s typ

~5 K/s max

~ 2 K/s min

~3.5 K/s typ

~5 K/s max

Time 25°C to 25°C

4 minutes

4 minutes

First Wave

Second Wave

Preheat area

Cool down area

Time