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M95M02-DR 数据表(PDF) 40 Page - STMicroelectronics |
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M95M02-DR 数据表(HTML) 40 Page - STMicroelectronics |
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40 / 45 page ![]() Package information M95M02-DR 40/45 DocID18203 Rev 10 Figure 26. WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale package recommended footprint 1. Dimensions are expressed in millimeters. aaa - - 0.110 - - 0.0043 bbb - - 0.110 - - 0.0043 ccc - - 0.110 - - 0.0043 ddd - - 0.060 - - 0.0024 eee - - 0.060 - - 0.0024 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 17. WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale package mechanical data (continued) |
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