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STM32F031F6 数据表(PDF) 87 Page - STMicroelectronics |
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STM32F031F6 数据表(HTML) 87 Page - STMicroelectronics |
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87 / 106 page ![]() DocID025743 Rev 4 87/106 STM32F031x4 STM32F031x6 Package information 102 Figure 37. UFQFPN32 package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must be connected. It is referred to as pin 0 in Table: Pin definitions. |
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