STWLC03

Package information

DocID027918 Rev 2

3/5

Table 2: Flip Chip 77 bumps (3.12x4.73 mm) package mechanical data

Dim.

mm

Min.

Typ.

Max.

A

0.50

0.55

0.60

A1

0.17

0.20

0.23

A2

0.28

0.30

0.32

b

0.23

0.26

0.29

D

4.67

4.70

4.73

D1

4.00

E

3.06

3.09

3.12

E1

2.40

e

0.40

SD

0.20

SE

0.20

fD

0.352

fE

0.346

$

0.05

ccc

0.075

The terminal A1 on the bump side is identified by a distinguishing feature (for

instance by a circular "clear area", typically 0.1 mm diameter) and/or a missing

bump. The terminal A1 on the backside of the product is identified by a

distinguishing feature (for instance by a circular "clear area", typically between 0.1

and 0.5 mm diameter, depending on the die size).

Figure 2: Flip Chip 77 bumps (3.12x4.73 mm) recommended footprint