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STM32F031F4 数据表(PDF) 86 Page - STMicroelectronics |
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STM32F031F4 数据表(HTML) 86 Page - STMicroelectronics |
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86 / 106 page  Package information STM32F031x4 STM32F031x6 86/106 DocID025743 Rev 4 Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 36. LQFP32 package marking example 1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering Samples to run qualification activity. 7.3 UFQFPN32 package information UFQFPN32 is a 32-pin, 5x5 mm, 0.5 mm pitch ultra-thin fine-pitch quad flat package. |
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