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STM32F745VG 数据表(PDF) 5 Page - STMicroelectronics |
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STM32F745VG 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 227 page ![]() DocID027590 Rev 4 5/227 STM32F745xx STM32F746xx Contents 5 5.3.29 Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 191 5.3.30 LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 192 5.3.31 SD/SDIO MMC card host interface (SDMMC) characteristics . . . . . . . 194 6 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 6.1 LQFP100, 14 x 14 mm low-profile quad flat package information . . . . . 196 6.2 TFBGA100, 8 x 8 x 0.8 mm thin fine-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199 6.3 WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202 6.4 LQFP144, 20 x 20 mm low-profile quad flat package information . . . . . 205 6.5 LQFP176, 24 x 24 mm low-profile quad flat package information . . . . . 208 6.6 LQFP208, 28 x 28 mm low-profile quad flat package information . . . . . 212 6.7 UFBGA 176+25, 10 x 10 x 0.65 mm ultra thin-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216 6.8 TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219 6.9 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222 7 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223 Appendix A Recommendations when using internal reset OFF . . . . . . . . . . . 224 A.1 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225 |
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