Absolute Maximum Ratings

If MilitaryAerospace specified devices are required please contact the National Semiconductor Sales Office

Distributors for availability and specifications

LM2900LM3900

LM3301

Supply Voltage

g

g

Molded DIP

1080 mW

1080 mW

SO Package

765 mW

a

b

Output Short-Circuit DurationOne Amplifier

Continuous

Continuous

Operating Temperature Range

b

LM2900

b

LM3900

Storage Temperature Range

b

b

Lead Temperature (Soldering 10 sec)

260 C

260 C

Soldering Information

Dual-In-Line Package

Soldering (10 sec)

260 C

260 C

Small Outline Package

Vapor Phase (60 sec)

215 C

215 C

Infrared (15 sec)

220 C

220 C

See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ for other methods of soldering surface mount

devices

ESD tolerance (Note 7)

2000V

2000V

Parameter

Conditions

LM2900

LM3900

LM3301

Units

Min

Typ Max

Min

Typ Max

Min

Typ Max

Open

Voltage Gain

Over Temp

VmV

Loop

Voltage Gain

D

12

28

12

28

12

28

Input Resistance

Inverting Input

111

MX

Output Resistance

8

8

9

kX

Unity Gain Bandwidth

Inverting Input

25

25

25

MHz

Input Bias Current

Inverting Input V

a

e

30

200

30

200

30

300

nA

Inverting Input

Slew Rate

Positive Output Swing

05

05

05

V ms

Negative Output Swing

20

20

20

Supply Current

62

10

62

10

62

10

Output

b

e

0

135

135

135

Voltage

V

a

e

Swing

b

e

10 mA

009

02

009

02

009

02

a

e

V

a

e

Absolute

b

e

0

Maximum Ratings

a

e

0

295

295

260

Output

Source

6

18

6

10

5

18

Current

Sink

(Note 2)

05

13

05

13

05

13

Capability

b

e

5 mA5

5

5

2