3

IXDN414PI / N414CI / N414CM / N414YI / N414YM

IXDI414PI / I414CI / I414CM / I414YI / I414YM

Param eter

Value

Supply Voltage

25V

All Other Pins

-0.3V to

VCC + 0.3V

Power Dissipation

≤85oC: TO220 (CI), TO263 (YI)

16W

≤125oC: TO220 (CM), TO263 (YM)

16W

≤25oC

8 Pin PDIP (PI)

975mW

TO220 (CI, CM), TO263 (YI, YM)

2W

Derating Factors (to Am bient)

8 Pin PDIP (PI)

7.6mW /oC

TO220 (CI, CM), TO263 (YI, YM)

0.1W /oC

Storage Temperature

-65oC to 150oC

Soldering Lead Tem perature

(10 seconds m axim um )

300oC

Unless otherwise noted, T

≤ V

25V .

All voltage measurements with respect to GND. Device configured as described in Test Conditions.

Electrical Characteristics

Operating Ratings

Parameter

Value

Maximum Junction Temperature

150oC

Operating Temperature Range

-40oC to 85oC

Thermal Impedance (Junction To Case)

TO220 (CI, CM),

TO263 (YI, YM) (

0.55oC/W

Symbol

Parameter

Test Conditions

Min

Typ

Max

Units

High input voltage

3.5

V

Low input voltage

0.8

V

Input voltage range

-5

V

Input current

0V

≤ V

IN

≤ V

CC

-10

10

µA

High output voltage

V

Low output voltage

0.025

V

Output resistance

@ Output high

600

1000

m

Ω

Output resistance

@ Output Low

600

1000

m

Ω

Peak output current

14

A

Continuous output

current

TO220 (CI), TO263 (YI)

3

4

A

A

Rise time

(1)

22

27

ns

Fall time

(1)

20

25

ns

On-time propagation

delay

(1)

30

33

ns

Off-time propagation

delay

(1)

31

34

ns

Power supply voltage

4.5

18

25

V

Power supply current

1

0

3

10

10

mA

µA

µA

(1)

See Figures 3a and 3b

Specifications subject to change without notice

Note 1: Operating the device beyond parameters with listed “Absolute Maximum Ratings” may cause permanent damage to the device.

Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The

guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum rated conditions for extended periods may

affect device reliability.

CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when handling

and assembling this component.