TLE7183F datasheet(9/28 Pages) INFINEON

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Data Sheet

2.2, 2016-01-27

TLE7183F

General Product Characteristics

Attention: Stresses above the ones listed here may cause permanent damage to the device. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Attention: Integrated protection functions are designed to prevent IC destruction under fault conditions

described in the data sheet. Fault conditions are considered as “outside” normal operating

range. Protection functions are not designed for continuous repetitive operation.

4.2

Functional Range

4.1.28

Peak reflow soldering temperature2)

Tref

–260

°C–

Thermal Resistance

4.1.29

Junction to case

RthjC

–5

K/W

–

Power Dissipation

4.1.30

Power Dissipation (DC) @

TCASE=125°C

Ptot

–2

–

ESD Susceptibility

4.1.31

ESD Resistivity3)

VESD

–2

4.1.32

ESD Resistivity (charge device model)4) VESD

–750

1) Not subject to production test, specified by design.

2) Reflow profile IPC/JEDEC J-STD-020C

3) ESD susceptibility HBM according to EIA/JESD 22-A 114B

4) ESD susceptibility CDM according to EIA/JESD 22-C 101

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.

4.2.1

Supply voltage1)2)

5.5

VDC

t<1s

4.2.2

Duty cycle3)

100

–

4.2.3

PWM frequency

FPWM

kHz

Total gate charge

400nC

4.2.4

Quiescent current4)

–30

µA

VS,VDH<20 V

4.2.5

Quiescent current into VDH

IQ_VDH

–30

µA

VDH<20V;

VS pin open

4.2.6

Supply current at Vs

IVs

–

175

110

FPWM=25kHz

QG=250nC:

VS = 5.5V

VS = 14V

VS = 17V

VS = 20V

4.2.7

Supply current at Vs(device

disabled by ENA)

IVs(o)

–60

Vs=5.5V..17V

Vs=17V..20V

4.2.8

Currrent into VDH (device not in

sleep mode)

IVDH

1.5

VVDH=5.5..20V

INH=high

Absolute Maximum Ratings (cont’d)1)

°C ≤

j ≤ 150 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified)

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Max.

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