AT9933 datasheet(5/16 Pages) MICROCHIP

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 2016 Microchip Technology Inc.

DS20005597A-page 5

AT9933

PWMD Pull-down Resistance

RPWMD

100

150

kΩ

VPWMD = 5V

GATE DRIVER

GATE Short Circuit Current

ISOURCE

0.165

—

VGATE = 0V

GATE Sinking Current

ISINK

0.165

—

VGATE = VDD

GATE Output Rise Time

TRISE

—

CGATE = 500 pF

GATE Output Fall Time

TFALL

—

CGATE = 500 pF

INPUT CURRENT SENSE COMPARATOR

Voltage required to turn on GATE VTURNON1

100

115

CS2 = 200 mV, CS1 increasing,

GATE goes LOW to HIGH (Note 1)

Voltage required to turn off GATE

VTURN-

OFF1

–15

CS2 = 200 mV, CS1 decreasing,

GATE goes HIGH to LOW (Note 1)

Delay to Output (Turn-on)

TD1,ON

—

150

250

CS2 = 200 mV,

CS1 = 50 mV to +200 mV step

Delay to Output (Turn-off)

TD1,OFF

—

150

250

CS2 = 200 mV,

CS1 = 50 mV to –100 mV step

OUTPUT CURRENT SENSE COMPARATOR

Voltage required to turn on GATE VTURNON2

100

115

CS1 = 200 mV, CS2 increasing,

GATE goes LOW to HIGH (Note 1)

Voltage required to turn off GATE

VTURN-

OFF2

–15

CS1 = 200 mV, CS2 decreasing,

GATE goes HIGH to LOW (Note 1)

Delay to Output (Turn-on)

TD2,ON

—

150

250

CS1 = 200 mV,

CS2 = 50 mV to +200 mV step

Delay to Output (Turn-off)

TD2,OFF

—

150

250

CS1 = 200 mV,

CS2 = 50 mV to –100 mV step

TEMPERATURE SPECIFICATIONS

Parameter

Sym.

Min.

Typ.

Max.

Unit

Conditions

TEMPERATURE RANGE

Operating Temperature

–40

—

+125

°C

Junction Temperature

—

+150

°C

Storage Temperature

–65

—

+150

°C

PACKAGE THERMAL RESISTANCE

8-lead SOIC

JA

—

+101

—

°C/W Note 1

Note 1: Mounted on a FR-4 board, 25 mm x 25 mm x 1.57 mm

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Specifications are at TA = 25°C, VIN = Open and VDD = 7.5V unless otherwise noted.

Parameter

Sym.

Min.

Typ.

Max.

Unit

Conditions

Note 1:

Specifications apply over the full operating ambient temperature range of –40ºC < TA < +125ºC.

2: Also limited by package power dissipation limit, whichever is lower

3: Depends on the current drawn by the part. See Section 4.0 “Application Information”

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