STM32F413MH datasheet(197/207 Pages) STMICROELECTRONICS

部件名	STM32F413MH

功能描述	ARM-Cortex-M4 32b MCUFPU, 125 DMIPS, up to 1.5MB Flash, 320KB RAM, USB OTG FS, 1 ADC, 2 DACs, 2 DFSDMs

PDF	207 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

197 / 207 page

DocID029162 Rev 2

197/207

STM32F413xG/H

Package information

205

Figure 82. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball

grid array recommended footprint

Note:

Non solder mask defined (NSMD) pads are recommended.

4 to 6 mils solder paste screen printing process.

Stencil opening is 0.400 mm.

Stencil thickness is between 0.100 mm and 0.125 mm.

Pad trace width is 0.120 mm.

0.550

0.600

0.650

0.0177

0.0197

0.0217

ddd

0.080

0.0039

eee

0.150

0.0059

fff

0.080

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 111. UFBGA144 recommended PCB design rules (0.80 mm pitch BGA)

Dimension

Recommended values

Pitch

0.80 mm

Dpad

0.400 mm

Dsm

0.550 mm typ. (depends on the soldermask

registration tolerance)

Table 110. UFBGA144 - 144-ball, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid

array package mechanical data (continued)

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

STM32F413MH 数据表(PDF) 197 Page - STMicroelectronics

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