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IS1871 数据表(PDF) 37 Page - Microchip Technology

部件名 IS1871
功能描述  Bluetooth짰 Low Energy (BLE) SoC
PDF  44 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

IS1871 数据表(HTML) 37 Page - Microchip Technology

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 2015-2016 Microchip Technology Inc.
DS60001371C-Page 37
IS1870/71
APPENDIX B:
LAYOUT
GUIDELINES
B.1
RF Matching
The RF traces (including Tx, Rx, and antenna path) on
the PCB should match 50Ω impedance. In Figure A-1,
value of L1, L3, C1, C2, and C5 are fixed. The antenna
matching components C6, C7, and L2 should be
adjusted to match the 50Ω 2.4 GHz antenna.
B.2
PMU
The PMU section components, such as VBAT, BK_IN,
BK_O, BK_LX, AVDD, ULPC_O, CLDO_O, VREF
should be kept close to the IS1870/71.
For additional information on PCB design guidelines,
contact your local Microchip sales office. A list of Micro-
chip sales offices is given on the back page of this doc-
ument,.
The L4 and C14 of Buck section, shown in Figure A-1,
should be selected carefully. Capacitor C14 is either
4.7 μF/6.3V, X5R, or X7R type. The inductor L4 need to
be high current (IDC>300mA) and low DCR (<1Ω) type.
B.3
Crystal
The XI 32 MHz crystal specification should be within
the ±10 ppm range, see Figure A-1.
IS1870SF_IS1871SF.book Page 37 Thursday, March 31, 2016 10:29 AM



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