API TECHNOLOGIES

• 8061 Avonia Rd. • Fairview, PA 16415 • Ph: 814-474-1571 • Fax: 814-474-3110 • eis.apitech.com

API TECHNOLOGIES’ SPECTRUM CONTROL GmbH

• Hansastrasse 6 • 91126 Schwabach, Germany • Phone: (49)-9122-795-0 • Fax: (49)-9122-795-58

SM11

Surface Mount Low Pass Filters

MSM Series

.049

(1.25±0.2)

.078 (2.0±0.2)

.049

(1.25±0.2)

.007

(0.2±0.1)

.007

(0.2±0.1)

Working Voltage . . . . . . . . . . 50 VDC

Test Voltage . . . . . . . . . . . . 150 VDC

Current Rating . . . . . . . . . . 10 Amps max.

Insulation Resistance. . . . . . 1.0 MΩ

Terminations. . . . . . . . . . . . Ni-Barrier

Soldering Conditions . . . . . . Max. 250˚C-5 sec.

MSM

Output

Input

Ground

Feed-through

MSM Ordering Information

Length (L) Max.

Top side

chip

GND

Copper foil pattern

0.3

GND

0.6

2.6

PO.8

GND

Copper foil pattern

0.3

GND

0.6

2.6

chip

Bottom side

Ground pattern

Ground pattern

Through hole

Through hole

Top side

Bottom side

Full-face ground

Bottom side

Surface

.098

(2.5)

Through hole .023 (ø 0.6)

.047

(1.2)

.031

(0.8)

.058 (1.5)

.110 (2.8)

.070

(1.8)

Copper foil pattern

Resist

Unit: mm Size difference: ±0.1

Thickness of copper foil: 35µm

Chip

ø .045 (1.15±0.05) Center hole

.057 (1.45±0.2)

.157

(4.0±0.1)

.078

(2.00±0.05)

ø .058 (1.5±0.1-0)

.137

(3.50±.05)

.068 (1.75±0.1)

.023 (0.6) Max.

.117 (3.0) Max.

.157

(4.0±0.1)

Dimensions in inches (mm)

.049

(1.25±0.2)

.078 (2.0±0.2)

.049

(1.25±0.2)

.007

(0.2±0.1)

.007

(0.2±0.1)

Dimensions in inches (mm)

MSM

50

40

20

30

10

0

1

10000

Frequency (MHz)

10

100

1000

60

102Z

151M

470M

271M

MSM Recommended Board Pattern

MSM Tape and Reel Packaging

Length (L) Max.

Top side

chip

GND

Copper foil pattern

0.3

GND

0.6

2.6

PO.8

GND

Copper foil pattern

0.3

GND

0.6

2.6

chip

Bottom side

Ground pattern

Ground pattern

Through hole

Through hole

Top side

Bottom side

Full-face ground

Bottom side

Surface

.098

(2.5)

Through hole .023 (ø 0.6)

.047

(1.2)

.031

(0.8)

.058 (1.5)

.110 (2.8)

.070

(1.8)

Copper foil pattern

Resist

Unit: mm Size difference: ±0.1

Thickness of copper foil: 35µm

Chip

ø .045 (1.15±0.05) Center hole

.057 (1.45±0.2)

.157

(4.0±0.1)

.078

(2.00±0.05)

ø .058 (1.5±0.1-0)

.137

(3.50±.05)

.068 (1.75±0.1)

.023 (0.6) Max.

.117 (3.0) Max.

.157

(4.0±0.1)

Note: Exclusively for reflow soldering

Specifications

PartNumber Temperature Capacitance Capacitance Current RatedRating Temperature

Characteristics

Tolerance

Rating

Rating

Range

MSM4T470M10

T

47pF

-55/+125˚C

MSM4R151M10

R

150pF

+50/-20%

10A

50VDC

-55/+125˚C

MSM4R271M10

R

270pF

-55/+125˚C

MSM4V102M10

V

1000pF

-25/+85˚C

Insertion Loss

MSM

4T

470M

10

T

Style

MSM

(Miniature)

Capacitance

Circuit

Configuration

4-Feed-Through

Current

Rating

10 Amps

Value

47 pF

Tolerance

+50/- 20%

Packaging

T-TapeandReel

2,000 pcs/reel

B-Bulkpack

1,000pcs/reel

Temperature

Characteristic

R-+/-15%

T-+22/-33%

V-+22/-82%