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DIP24 数据表(PDF) 2 Page - STMicroelectronics

部件名 DIP24
功能描述  Thermal Data
PDF  2 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

DIP24 数据表(HTML) 2 Page - STMicroelectronics

  DIP24 Datasheet HTML 1Page - STMicroelectronics DIP24 Datasheet HTML 2Page - STMicroelectronics  
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Thermal Data
DIP 24
2/2
1)
2)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
3
55
60
65
70
75
80
85
dissipated power ( Watt )
Rth(j-a) (ºC/W)
floating in air
mounted on board
copper frame thickness = 0.25 mm
die pad = 150 x 280 sq.mils
die size = 10.000 sq.mils
0.001
0.01
0.1
1
10
100
1,000
1
2
3
5
10
20
30
50
100
Time or pulse width ( s )
Transient Thermal Resistance (ºC/W)
on die dissipating area = 2000 sq.mils
mounted on board
pd = 2 Watt
copper frame thickness = 0.25 mm
die pad = 110 x 280 sq.mils



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