MDS 501A B

6

Revision 120704

ICS501A

Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body)

Package dimensions are kept current with JEDEC Publication No. 95

Ordering Information

While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)

assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would

result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial

applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary

environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any

circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or

critical medical instruments.

Part / Order Number

Marking

Shipping Packaging

Package

Temperature

ICS501AM

501AM

Tubes

8-pin SOIC

0 to +70

° C

ICS501AMT

501AM

Tape and Reel

8-pin SOIC

0 to +70

° C

ICS501AMI

501AI

Tubes

8-pin SOIC

-40 to +85

° C

ICS501AMIT

501AI

Tape and Reel

8-pin SOIC

-40 to +85

° C

ICS501A-DWF

-

Die on uncut, probed wafers

0 to +70

° C

ICS501A-DPK

-

Tested die in waffle pack

0 to +70

° C

INDEX

AREA

1 2

8

D

E

SEATING

PLANE

A1

A

e

- C -

B

.10 (.004)

C

C

L

H

h x 45

Millimeters

Inches

Symbol

Min

Max

Min

Max

A

1.35

1.75

.0532

.0688

A1

0.10

0.25

.0040

.0098

B

0.330.51

.013.020

C

0.19

0.25

.0075

.0098

D

4.80

5.00

.1890

.1968

E

3.80

4.00

.1497

.1574

e

1.27 BASIC

0.050 BASIC

H

5.80

6.20

.2284

.2440

h

0.250.50

.010.020

L

0.401.27

.016.050

α

0

°

8

°

0

°

8

°