Thick Film Low Resistance

Kelvin Flip Chip

LRK Series

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Issue B · 03.02

Welwyn Components

32

Test

Test Method

Typical Performance

Thermal shock

MIL-STD-202, method 107D -55 to 125°C, 5 cycles 30 Min

±0.5%

Short time overload

MIL-PRF-55342

±0.5%

High temperature exposure

MIL-PRF-55342 100 hours at 125°C

±0.5%

Temperature cycling

MIL-STD-833, method 1010 test condition B

±0.25%

Moisture resistance

MIL-STD-202, method 106E

±0.5%

Load life

MIL-STD-202, method 108 rated power 1000 hours at 70°C

±1.0%

Low temperature operation

MIL-PRF-55342

±0.5%

120

100

80

60

40

20

0

30

50

70

90

110

130

150

Derating Curve

Packaging

Resistors are supplied taped and reeled.

Performance Data

OBSOLETE