High Power

Chip Resistors

SC3 Series

High Power

Chip Resistors

SC3 Series

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Issue A · 03.02

Welwyn Components

Performance Data

Temperature Rise vs Pad Area

Construction

Resistive thick film material, overglaze and organic protection

are screen printed on a 96% alumina substrate. The

components are laser trimmed to achieve the required

resistance tolerance.

Terminations

The wrap-around copper terminations have an electroplated

nickel barrier and tin-lead solder coating, this ensures

excellent ‘leach’ resistance properties and solderability.

Chips can withstand immersion in solder at 250˚C for 90

seconds and are suitable for reflow or wave soldering

mounting applications.

Marking

The body protection and marking are resistant to all normal

industrial cleaning solvents suitable for printed circuits.

Chips are packed and mounted with marking side up.

The SC3 Chips are mounted with the actual resistor element

mounted face down on its termination pads.

1000

100

10

Termination Pad Area (each end)

1 watt

2 watt

3 watt

Pulse Power Rating

100

10

1

0

.

0

1

0

.

1

1

.

0

Time (sec)

The wrap-around terminations have an electroplated nickel

barrier and matte tin finish. This ensures

excellent ‘leach’ resistance properties and solderability.

04.10

AEC-Q200 Table 7

Method

Max.+0.01

Typ.

ref

Test

3

High Temp. Exposure

MIL-STD-202 Method 108

R%

0.5

0.2

4

Temperature Cycling

JESD22 Method JA-104

R%

0.25

0.1

6

Moisture Resistance

MIL-STD-202 Method 106

R%

0.5

0.2

7

Biased Humidity

MIL-STD-202 Method 103

R%

0.5

0.1

8

Operational Life (Cyclic Load)

MIL-STD-202 Method 108

R%

1.0

0.5

14

Vibration

MIL-STD-202 Method 204

R%

0.25

0.05

15

Resistance to Soldering Heat

MIL-STD-202 Method 210

R%

0.25

0.05

16

Thermal Shock

MIL-STD-202 Method 107

R%

0.5

0.2

18

Solderability

J-STD-002

>95% coverage

21

Board Flex

AEC-Q200-005

R%

0.25

0.05

22

Terminal Strength

AEC-Q200-006

R%

0.25

0.05

Short Term Overload

6.25 x Pr for 2s

R%

0.5

Low Temperature Storage

Low Temperature Operation

-65°C for 100 hours

R%

R%

R%

0.5

Shelf Life Test

Room temp for 12 months

-65°C for 1 hour then Pr for 45 minutes

0.5

0.1

Leach Resistance

Solder dip at 250°C

90s minimum

04.16

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

© TT Electronics plc

www.ttelectronicsresistors.com

BI Technologies IRC Welwyn