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ML-C 数据表(PDF) 1 Page - Cree, Inc |
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ML-C 数据表(HTML) 1 Page - Cree, Inc |
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1 / 19 page ![]() 11 Product family data sheet Copyright © 2011-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Cree® XLamp® ML-C LEDs ProDuCt DEsCriPtion The Cree XLamp® ML-C LeD brings lighting-classreliabilityandperformance to 1/3-watt LeDs. The XLamp ML-C LeD expands Cree’s lighting-class leadership to LeD bulbs and linear and distributed lighting applications. With XLamp LeD lighting-class reliability, a wide viewing angle, uniform light output, and industry-leading chromaticity binning in a 3.5-mm X 3.5-mm package, the XLamp ML-C LeD continues Cree’s history of segment-focused product innovation in LeDs for lighting applications. The XLamp ML-C LeD brings high performance and a smooth look to a wide range of lighting applications, including linear lighting, fluorescent retrofits and retail-display lighting. FEAturEs • Available in white (2600 K to 8300 K CCT), 80-, 85- and 90-CRI minimum and royal blue • White LeDs available in both parallel and series • ANSI-compatible sub-bins • Maximum drive current: 350 mA for parallel, 175 mA for series, 250 mA for royal blue • 120° viewing angle, uniform chromaticity profile • electrically neutral thermal path • RoHS and ReACh compliant • UL® recognized component (E349212) tAbLE oF ContEnts Characteristics ............................................2 Flux Characteristics ....................................3 Relative Spectral Power Distribution .........6 Relative Luminous Flux vs. Junction Temperature ................................................7 Relative Radiant Flux vs. Junction Temperature ................................................7 electrical Characteristics............................8 Relative Luminous Flux vs. Current............9 Relative Radiant Flux vs. Current ............ 10 Typical Spatial Distribution...................... 11 Thermal Design........................................ 12 Reflow Soldering Characteristics............ 14 Notes ........................................................ 15 Mechanical Dimensions .......................... 17 Tape and Reel........................................... 18 Packaging................................................. 19 |
类似零件编号 - ML-C |
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类似说明 - ML-C |
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