Attenuator DIE

DC - 40 GHz

Rev. V3

MAT10xxx Series

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Features

 Medium Power Handling 2 W CW

 Flat Response from DC to 40 GHz

 Return Loss:

>18 dB DC to 12 GHz

>16 dB 13 to 40 GHz

 Space Saving Footprint:

0.030” x 0.030” (.762 x .762 mm)

 Very Good Stability Over Temperature

(TRC <100 PPM)

 Ground Wrap to Top

(No ground bonding required)

 RoHS* Compliant

Description

These fixed attenuator chips are fabricated using our

state of the art thin film metallization and advanced

photolithography technology.

All devices are available in chip form with a

metalized ground connection on the back. This

ground is wrapped around on the four corners of the

chip so additional ground bonding ribbon is not

required.

The chips may be attached using conductive epoxy

or solder preform. Gold contacts on the input and

output pads make assembly, using standard

bonding equipment, fast and reliable. Custom values

and configuration available on request.

Part Number

Attenuation (dB)

Insertion Loss (dB)

Return Loss (dB)

MAT10010

1

+/-0.30

>18

MAT10020

2

+/-0.30

>18

MAT10030

3

+/-0.30

>18

MAT10040

4

+/-0.30

>18

MAT10050

5

+/-0.30

>18

* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.

Front to back metallization in 4 places

Bonding pad sizes and resistor outline

may differ from value to value.

CONTINUED