Typical Performance Characteristics

LM4850LD

Power Dissipation vs Output Power

LM4850LD (Note 13)

Power Derating Curve

20001079

20001094

Note 13: This curve shows the LM4850LD’s thermal dissipation ability at different ambient temperatures given the exposed-DAP of the part is soldered to a plane

of 1oz. Cu with an area given in the label of each curve. This label also designated whether the plane exists on the same (top) layer as the chip, on the bottom layer,

or on both layers. Infinite heatsink and unattached (no heatsink) conditions are also shown.

Typical Performance Characteristics

Non-LD Specific Characteristics

THD+N vs Frequency

THD+N vs Frequency

20001063

20001064

THD+N vs Frequency

THD+N vs Frequency

20001065

20001066

www.national.com

6