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HMC558ALC3BTR-R5 数据表(PDF) 14 Page - Analog Devices |
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HMC558ALC3BTR-R5 数据表(HTML) 14 Page - Analog Devices |
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14 / 15 page ![]() HMC558A Data Sheet Rev. 0 | Page 14 of 15 APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT 9 8 7 1 2 3 45 6 12 11 10 LO RF IF Figure 34. Typical Application Circuit EVALUATION BOARD INFORMATION The circuit board used in an application must use RF circuit design techniques. Signal lines must have 50 Ω impedance, and the package ground leads and exposed pad must be connected directly to the ground plane, similarly to that shown in Figure 35. Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 35 is available from Analog Devices, Inc., upon request. J2 J1 J3 U1 IF RF LO Figure 35. HMC558A Evaluation Board Top Layer Table 5. Bill of Materials for the EV1HMC558ALC3B Evaluation Board Level Item Part Number Quantity Reference Designator Description 1 1 117611-1 1 PCB, evaluation board 1 2 104935 2 J1 to J2 2.92 mm connector, SRI 1 3 105192 1 J3 SMA connector, Johnson 1 4 HMC558ALC3B 1 U1 Device under test (DUT) |
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