ams Datasheet

Page 5

[v1-43] 2015-Jul-23

Document Feedback

AS1313 − Absolute Maximum Ratings

Note(s) and/or Footnote(s):

1. Junction-to-ambient thermal resistance is very dependent on application and board-layout. In situations where high maximum

power dissipation exists, special attention must be paid to thermal dissipation during board design.

2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Nonhermetic Solid State Surface Mount Devices”.

Temperature Ranges and Storage Conditions

(1)

Thermal resistance

WL-CSP

95

°C/W

MLPD

36

°C/W

Operating temperature

-40

85

°C

Junction

temperature

WL-CSP

25

°C

MLPD

150

°C

Storage temperature range

-55

125

°C

Package body

temperature

WL-CSP

260

°C

Norm IPC/JEDEC J-STD-020 (2)

MLPD

Norm IPC/JEDEC J-STD-020 (2)

The lead for Pb-free leaded

packages is matte tin

(100% Sn)

Relative humidity

non-condensing

585

%

MSL

Moisture sensitivity

level

WL-CSP

1

Represents an unlimited floor

life time

MLPD

1

Represents an unlimited floor

life time

Symbol

Parameter

Min

Max

Units

Comments