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AS7C3513 数据表(PDF) 2 Page - Alliance Semiconductor Corporation

部件名 AS7C3513
功能描述  5V/3.3V 32K x 6 CMOS SRAM
PDF  8 Pages
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制造商  ALSC [Alliance Semiconductor Corporation]
网页  https://www.alliancememory.com
标志 ALSC - Alliance Semiconductor Corporation

AS7C3513 数据表(HTML) 2 Page - Alliance Semiconductor Corporation

  AS7C3513 Datasheet HTML 1Page - Alliance Semiconductor Corporation AS7C3513 Datasheet HTML 2Page - Alliance Semiconductor Corporation AS7C3513 Datasheet HTML 3Page - Alliance Semiconductor Corporation AS7C3513 Datasheet HTML 4Page - Alliance Semiconductor Corporation AS7C3513 Datasheet HTML 5Page - Alliance Semiconductor Corporation AS7C3513 Datasheet HTML 6Page - Alliance Semiconductor Corporation AS7C3513 Datasheet HTML 7Page - Alliance Semiconductor Corporation AS7C3513 Datasheet HTML 8Page - Alliance Semiconductor Corporation  
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The AS7C513 and the AS7C3513 are high performance CMOS 524,288-bit Static Random Access Memory (SRAM) devices organized as
32,768 words × 16 bits. They are designed for memory applications where fast data access, low power, and simple interfacing are desired.
Equal address access and cycle times (tAA, tRC, tWC) of 12/15/20 ns with output enable access times (tOE) of 5/7/9 ns are ideal for high
performance applications. The chip enable input CE permits easy memory expansion with multiple-bank memory systems.
When CE is high, the devices enter standby mode. The AS7C513 and AS7C3513 are guaranteed not to exceed 28/18 mW power
consumption in CMOS standby mode. The devices also offer 2.0V data retention.
A write cycle is accomplished by asserting write enable (WE), (UB) and/or (LB), and chip enable (CE). Data on the input pins I/O0-I/O7,
and/or I/O8–I/O15, is written on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices
should drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting output enable (OE), (UB) and (LB), and chip enable (CE), with write enable (WE) high. The chips
drive I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or write enable is
active, or (UB) and (LB), output drivers stay in high-impedance mode.
The devices provide multiple center power and ground pins, and separate byte enable controls, allowing individual bytes to be written and
read. LB controls the lower bits, I/O0–I/O7, and UB controls the higher bits, I/O8–I/O15.
All chip inputs and outputs are TTL-compatible. The AS7C513 and AS7C3513 are packaged in common industry standard packages.
NOTE: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions outside those indicated in the operational sections of this specificati on is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect reliability.
Key: X = Don’t care; L = Low; H = High
Parameter
Device
Symbol
Min
Max
Unit
Voltage on VCC relative to GND
AS7C513
Vt1
–0.50
+7.0
V
AS7C3513
Vt1
–0.50
+5.0
V
Voltage on any pin relative to GND
Vt2
–0.50
VCC +0.50
V
Power dissipation
PD
–1.0
W
Storage temperature (plastic)
Tstg
–65
+150
o C
Ambient temperature with VCC applied
Tbias
–55
+125
o C
DC current into outputs (low)
IOUT
–50
mA
CE
WE
OE
LB
UB
I/O0–I/O7
I/O8–I/O15
Mode
H
X
X
X
X
High Z
High Z
Standby (ISB, ISBI)
LH
L
L
H
DOUT
High Z
Read I/O0–I/O7 (ICC)
LH
L
H
LHigh Z
DOUT
Read I/O8–I/O15 (ICC)
LH
L
LLDOUT
DOUT
Read I/O0–I/O15 (ICC)
LLX
LLDIN
DIN
Write I/O0–I/O15 (ICC)
LLX
LH
DIN
High Z
Write I/O0–I/O7 (ICC)
LLX
H
L
High Z
DIN
Write I/O8–I/O15 (ICC)
L
L
H
X
H
X
X
H
X
H
High Z
High Z
Output disable (ICC)



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