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ILX751B

Notes on Handling

1) Static charge prevention

CCD image sensors are easily damaged by static discharge. Before handling, be sure to take the following

protective measures.

a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive

shoes.

b) When handling directly use an eath band.

c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.

d) lonized air is recommended for discharge when handling CCD image sensors.

e) For the shipment of mounted substrates use cartons treated for the prevention of static charges.

2) Notes on handling CCD Cer-DIP package

The following points should be observed when handling and installing Cer-DIP packages.

a) Remain within the following limits when applying static load to the ceramic portion of the package:

(1) Compressive strength: 39N/surface

(Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.)

(2) Shearing strength:

29N/surface

(3) Tensile strength:

29N/surface

(4) Torsional strength:

0.9Nm

Upper ceramic layer

39N

Lower ceramic layer

Low-melting glass

(1)

29N

(3)

0.9Nm

(4)

29N

(2)

b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be

generated and the package may fracture, etc., depending on the flatness of the ceramic portion.

Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.

c) Be aware that any of the following can cause the glass to crack because the upper and lower ceramic

layers are shielded by low-melting glass.

(1) Applying repetitive bending stress to the external leads.

(2) Applying heat to the external leads for an extended period of time with a soldering iron.

(3) Rapid cooling or heating.

(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as

tweezers.

(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.

Note that the preceding notes should also be observed when removing a component from a board after

it has already been soldered.

3) Soldering

a) Make sure the package temperature does not exceed 80°C.

b) Solder dipping in a mounting furnace causes demage to the glass abd other defects. Use a 30W

soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount,

cool sufficiently.

c) To dismount image sensors, do not use a solder suction equipment. When using an electric desoldering

tool, ground the controller. For the control system, use a zero cross type.